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Leica
不僅是在光學解析有良好的表現, 在半導體晶圓與材料檢視應用的效能上, 更是首屈一指的典範.
經過全球十大半導體廠與十大電子廠的現場測試, 所有參與的科技界工程師, 一致給予最高的評價. |
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SIL8000 Wafer Loader
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Specifications
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Wafer size 150 - 200
mm - software change (other sizes on request)
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Wafer thickness 250 –
760 μm
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Clean room
compatibility Class 10 clean room compatible (parts
in contact with wafer)
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Control Computer
control with touch screen operator interface
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Type of inspection
Micro inspection - Front macro inspection
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Inspection mode
Sequential, sampling or statistical access
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Compatible
microscopes LEICA DM8000 - other microelectronics
microscopes
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Footprint W 500 x D
550 x H 350
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Facilities AC 220 -
240 V - 3,5 A 50 /60 Hz
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Vacuum - 60 to -90
KPa - 10 l/min
- Compressed air 6 bar - 1 nl/min
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MIL8000 Inspection
Macro/Micro wafer inspection system
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Specifications
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Wafer size 150 - 200
mm - single or dual size (other sizes on request)
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Wafer thickness 170 –
1200 μm ( * depending on warpage and bow)
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Clean room
compatibility Class 10 clean room compatible (parts
in contact with wafer)
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Control Computer
control with touch screen operator interface
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Type of inspection
Front macro, back macro, micro inspection
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Inspection mode
Sequential, sampling or statistical access
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Centering Position
controlled edge aligner
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Compatible
microscopes LEICA DM8000 - other microelectronics
Microscopes
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Footprint W 650 x D
650 x H 650 (including Back unit in up position)
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Macro illuminators
Pure green or white LED units for front and back
inspection
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Facilities AC 220 -
240 V - 3,5 A 50 /60 Hz
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Vacuum - 60 to -90
KPa - 10 nl/min
- Compressed air or nitrogen - 6
bar - 60 nl/min max.
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